Technology Transfer possible with following companies.

RNT - Reactive Nano Technologies
Makes the impossible possible! Exothermic foil for in-situe heating of solder or braze
connective interfaces. Heat the solder, not the components!

IPDiA
Brings the NXP Integrated Passive Technology to your product. Passive integration combined with superb high density interconnect silicon interposer!

 
HDPUG 
High Density Packaging User Group,a consortium of OEMs and their suppliers running joint technology assessment projects.!

 
  

Cheapest Au plating, but most versatile for all soldering and bonding.
No Ni, no black pads. Cheaper than ENIG and still easy bondable.